TIM-CAT - Apply the perfect layer of thermal paste

Thermal Management

The quest for ideal CPU thermal management is as old as the CPU itself, but as chip innovation progresses, thermal management becomes increasingly important. Chip size decreases. Processing power increases. Temperatures climb! Increasing temperatures lead to reduced performance, overheating, and eventual failure.

Overheating

Reduced Performance

Current solutions involve applying a thermal interface material, like thermal paste, between the processor and a heatsink. But the question always comes up, "How much thermal paste should I use?" and then the follow-up question, "How do I apply thermal paste for the best heat transfer?". Read most websites and you feel like you're stuck in a Goldilocks Scenario.

Not Enough = increased thermal resistance leading to higher temps

Too Much = increased thermal resistance leading to higher temps

thermal interface material compound application tool

TIMCAT has entered the chat

Using big brain ideas stemming from research into Thermally Conductive / Electrically Insulative (TCEI) materials we discovered the ideal thermal material thickness. After this discovery, we went to work developing a tool that would allow anyone to apply the perfect thickness of thermal paste every time. Thus, TIMCAT was born.

1mil

At 1 mil the porridge is just right! In technical terms that means the thermal resistance is minimized, maximizing heat transfer away from the CPU.

By perfectly applying 1 mil (1 one-thousandth of an inch) of thermal paste you're able to fill the microscopic gaps that exist between the Integrated Heat Spreader (IHS) and the CPU Cooler without introducing excessive thermal resistance.

apply the perfect layer of thermal paste

Perfect 1mil Layer of Thermal Paste

lower temperatures by applying thermal paste perfectly

Lower CPU Temperatures

increase performance with perfect application of thermal paste

Increased Performance

Dr. Cantwell Carson

TIMCAT was developed by Dr. Cantwell Carson, a research scientist and an expert in thermal management. The idea for TIMCAT arose during Dr. Carson's research and development of TCEI materials for military application.

United Protective Technologies (UPT) solves the most difficult surface engineering challenges faced by the US military and manufacturers. From hypersonic applications to common components used in manufacturing, UPT has developed and continues to develop novel surface protection technologies.

TIMCAT

thermal interface material compound application tool

Patent Pending